Processing "Drilling and Slitting"
For substrates of all shapes! Accurate hole drilling and slitting processing is possible!
"Drilling and Slitting Processing" is a technology that allows for drilling holes with a diameter of φ0.3 or larger in ceramics and special glass, according to your desired hole diameter and pitch. It is possible to perform precise drilling and slitting processing not only on flat plates but also on various shapes of substrates, including circles, squares, long holes, and angled shapes. Please feel free to consult us if you have any requests. [Features] ■ Drilling processing is possible with specified hole diameter and pitch ■ Drilling and slitting processing is possible on various shapes of substrates *For more details, please contact us or download the catalog.
- Company：笹原光学工業所
- Price：Other
